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Rugged laser processing head up to 300W

 

 

  • Laser Processing Head LH501 with High Power D80 Connector.

    Laser processing head LH501 with D80 glass fiber connector and pyrometer and CCD camera

  • Laser Processing Head LH501 with Pyrometer and CCD for High Power LLK-A Connector.

    Laser processing head LH501 with connector for LLK-A laser glas fiber cable

  • Laser Processing Head LH501 with Pyrometer for High Power LLK-A Connector.

    Laser processing head with LLK-A laser fiber connector and pyrometer

  • Laser Processing Head LH501 with Wire Feeder for Laser Soldering.

    Laser processing head LH501 with pyrometer and CCD camera and solder wire feeder
    Application : Laser soldering with high power laser

  • Laser Processing Head attached to desktop soldering robot.

    Laser processing head LH501 with pyrometer and CCD camera and solder wire feeder
    Mounted on rotary axis of desktop robot

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Mini laser processing head LH102

 

 

  • Der kompakte Laserkopf LH102.

    Compact laser processing head LH102 with pyrometer

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Data Sheet LH501.pdf

The laser head LH501 is suitable as laser processing head head for laser soldering and plastic welding for diode lasers in the range of 100W - 300W light output.The laser head LH501 is optionally equipped with a fiber-coupled pyrometer and a video camera. The pyrometer and video camera are reflected coaxially into the beam path of the laser via beam splitters. The video camera is clamped and can still be focused even when processing material out of the focus.If required, the LH501 can be cooled via a cooling flange by means of air or water. In addition, a process gas can be supplied via a separate connection.A solder wire feed unit can be adapted to the laser head. This results in a compact system for laser soldering with solder wires or also solder paste.Laser glas fiber cables with FSMA905, D80 or LLK-A connector can be connected. IPG diode lasers with a fixed collimator (pigtailed) can also be connected to the process head.

  •      Maximum laser power 500W
  •      Fiber optic connector FSMA905 or D80 or LLK-A or IPG fixed collimator
  •      Optionally with pyrometer and video camera
  •      Pyrometer and camera coaxial to the laser beam
  •      USB camera with SXGA resolution
  •      Camera focusable for working out of focus
  •      Ring light with adjustable brightness
  •      Typical working distance 50mm, 100mm, 150mm, 200mm, 250mm, 300mm
  •      Weight 1.2kg

Applications for the laser processing head LH501 include laser soldering, laser plastic welding, laser heating in the semiconductor industry of components in vacuum as well as applications in the research and development.

Data Sheet LH102.pdf

Especially for applications with limited space we offer the extremely compact laser processing head LH102 with a pyrometer, which is reflected in the beam path of the laser. With a dimension of only 52mm x 40mm and a weight of 0.2 kg, this laser head is not much larger than a matchbox. It can be used up to a maximum of 100W laser power.Optionally, the laser head LH102 is also available with a integrated CCD camera  (LH103).The lenses of the laser head can be exchanged so that, for example, it is easy to switch from point optics to line optics.Temperature measurement typically above approx. 120 ° C. Optionally from approx. 70 ° C.The properties of the infrared pyrometer integrated in the laser head correspond to the pyrometers on our pyrometer page.Please note: Our digital pyrometers are part of the measuring and control system LASCON ®.

  •  Suitable for optical power up to 100 W
  •  Wavelengths 808nm to 980nm
  •  AR coated, replaceable lenses
  •  Coaxial pyrometer with typ. temperature range of 120°C-700°C, optional 70°C
  •  Fiber Optic Connectors FSMA905, N.A. 0.22
  •  Minimum laser spot from approx. 100μm
  •  Visible pilot light, brightness adjustable via LASCON Process Manager software
  •  Base 52mm x 40mm
  •  Low weight (0.2 kg)

Due to the compact dimensions of the laser head is very well suited for integration into machines and plant with limited space.

This also includes machining with several laser systems simultaneously on one component.

Applications include laser soldering, laser plastic welding and laser heating during thermal bonding or soldering on wafers.

The laser head LH102 can also be easily combined with our wire feeder SWF100, so that an extremely compact laser soldering head is created, which due to its low weight can easily be adapted to desktop robots.

Due to the low weight and dimensions, the laser head is also suitable for mounting on rotary axes of desktop table robots


Mini Laser processing head LH103 with pyrometer and CCD camera

  • Laser Processing Head LH103 with Pyrometer Camera and Wire feeder.

    Comact laser processing head LH103

  • Laser Processing Head LH103 with Pyrometer Camera and Wire feeder.

    With mounting plate for adaption to a machine axis ( also rotary axis )

  • Laser Processing Head LH103 with Pyrometer Camera and Wire feeder.

    Connectors for glas fiber and infrared pyrometer cables

  • Laser Processing Head LH103 with Pyrometer Camera and Wire feeder.

    Laser processing head LH103 with solder wire feeder, ring light and cross jet

  • Laser Processing Head LH103 with Pyrometer Camera and Wire feeder.

    Compact laser processing head

  • Laser Processing Head LH103 with Pyrometer Camera for Solder Paste Melting or Laser Plastic Welding.

    Size comparision between LH501 and LH103

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Data Sheet LH103.pdf

The compact laser head LH103 is perfectly suited for integration in machines and plants.

Especially for applications with limited space we offer the extremely compact laser head LH103 with a pyrometer and a CCD camera, which are reflected in the beam path of the laser. With a weight of about 1.5 kg, this laser processing head can be mounted on light machine axes. The LH103 can be used up to a maximum of 100W laser power.

The CCD camera is used for process monitoring and is connected to the LASCON Camera Manager.
Alternatively, an image processing camera can also be integrated.
This allows positioning of the machining head via an image processing system.

The lenses of the laser head can be exchanged so that, for example, it is easy to switch from point optics to line optics.

Especially for laser soldering, a precision wire feed has been developed. It has a response time of 1ms and a resolution of 0.01mm. An integrated encoder is used to detect the end of the wire and detects any errors during the feeding process. The function of solder wire feeding is fully integrated into the LASCON scripting language. So there is no extra wiring.

The pyrometer measures temperature typically above approx. 120° C. Optionally from approx. 70° C.
The properties of the infrared pyrometer integrated in the laser head correspond to the pyrometers on our pyrometer page.

Please note: Our digital pyrometers are part of the measuring and control system LASCON ®.

  • Suitable for optical power up to 100 W
  • Wavelengths 808nm to 980nm
  • AR coated, replaceable optics
  • Coaxial infrared pyrometer and CCD camera
  • Optional image processing system for improved positioning
  • Optional image processing system for wire start detection
  • Typical temperature measuring range from 140 ° C - 700 ° C, optionally from 100 ° C
  • Fiber Optic Connectors FSMA905, N.A. 0.22
  • Minimum laser spot from approx. 100μm
  • Visible pilot light, brightness adjustable via LASCON Process Manager software
  • Low weight (about 1.5kg, incl. Wire feed)

Due to the compact dimensions this laser procesing head is very well suited for integration in machines and plant with little space and also for table robots

This also includes machining with several laser systems simultaneously on one component.

Applications include laser soldering, laser plastic welding and laser heating during thermal bonding or soldering on wafers.

The laser head LH103 can also be easily combined with our wire feeder SWF100, so that an extremely compact laser soldering head is created, which, due to its low weight, can be easily adapted to desktop robots.

The coaxial CCD camera is connected to the LASCON Camera Manager.
The CCD camera can optionally be replaced by an image processing camera. The image processing allows an exact positioning above the solder pad. The image processing system also allows the exact detection of the wire beginning before the soldering process.

Intelligent Laser Processing Head ILPH with integrated diode laser and LASCON Controller

  • Diodenlaser_ILPH_Intelligent Processing Head includes 60W Laser Source and Pyrometer and CCD_1

    Laser processing head with integrated 60W diode laser and LASCON process controller, camera and optional solder wire feeder

  • Diodenlaser_ILPH_Intelligent Processing Head on Machine Axis includes 60W Laser Source and Pyrometer and CCD_2

    ILPH for machine integration: only 2 cables to the machine: 24V dc and field bus
    It does not get any easier....

  • Diodenlaser_ILPH_Intelligent Processing Head on Machine Axis includes 60W Laser Source and Pyrometer and CCD_3

    Applications: Laser soldering with solder paste or flux cored solder wire
    Laser plastic welding ( contour )

  • Diodenlaser_ILPH_Intelligent Processing Head on Machine Axis includes 60W Laser Source and Pyrometer and CCD_4

    Simple machine integration

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Data Sheet ILPH.pdf

Laser systems and laser processing heads can usually only be integrated by specialists in machines and systems. The handling of fiber optic cables is critical. The ILPH is a complete laser processing system including diode laser (60W), LASCON® process controller, pyrometer, camera, optional wire feed controller and ring light source - all on board.
The ILPH can be mounted directly on a machine axis.
The ILPH requires only 2 cables: 24V dc and field bus Ethernet (optional EtherCAT)

  • Laser power up to 60W
  • Wavelength 978nm, others on request
  • Glass fiber diameter: Pigtailed 100μm
  • Laser spot diameter down to 100μm
  • Easy to integrate in machines and plants via digital and analogue I / Os -> LASCON
  • Easy to integrate with laser safety
  • Bus connection: Ethernet or optional EtherCAT
  • Integrated high-speed pyrometer with 10,000 measurements per second
  • Temperature measuring range typically from 120 ° C, optionally from 70 ° C
  • Integrated process controller for closed loop control with 10,000 control steps / s
  • Software package for process control: LASCON Process Controller
  • Software package for video camera: LASCON Camera Manager
  • 256 programmable laser process scripts
  • Data storage on internal flash disc
  • Data export to the hard disk of a production server possible
  • Power supply 24V, 8A max

The intelligent ILPH laser processing head is an ideal tool for integrating laser soldering into machines and systems.

All you need is the ILPH and a few cables (2,3). With these component you can go directly into laser soldering with pyrometer control. Thanks to the high brilliance, even extremely small laser spots up to a diameter of 100μm can be realized.

Other applications include laser plastic welding, laser heating and other laser processes.

The products presented here comply with laser class 4. The laser may only be operated in an environment that complies with national and international safety regulations.

Due to its compact design, the entire laser technical component is integrated in the process area. Therefore, it is relatively easy to build Category 1 laser equipment.